JPS6363567B2 - - Google Patents

Info

Publication number
JPS6363567B2
JPS6363567B2 JP54089626A JP8962679A JPS6363567B2 JP S6363567 B2 JPS6363567 B2 JP S6363567B2 JP 54089626 A JP54089626 A JP 54089626A JP 8962679 A JP8962679 A JP 8962679A JP S6363567 B2 JPS6363567 B2 JP S6363567B2
Authority
JP
Japan
Prior art keywords
polyamide
resin
methylolated
mol
heat resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54089626A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5614554A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8962679A priority Critical patent/JPS5614554A/ja
Priority to US06/167,335 priority patent/US4387192A/en
Priority to DE8080104023T priority patent/DE3066584D1/de
Priority to EP80104023A priority patent/EP0023610B1/en
Publication of JPS5614554A publication Critical patent/JPS5614554A/ja
Priority to US06/452,432 priority patent/US4451621A/en
Publication of JPS6363567B2 publication Critical patent/JPS6363567B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/305—Polyamides or polyesteramides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
JP8962679A 1979-07-13 1979-07-13 Heat resistant resin composition Granted JPS5614554A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP8962679A JPS5614554A (en) 1979-07-13 1979-07-13 Heat resistant resin composition
US06/167,335 US4387192A (en) 1979-07-13 1980-07-09 Heat resistant polyamide-imide resin from polycarboxylic acid-polyisocyanate modified with unsaturated monomer
DE8080104023T DE3066584D1 (en) 1979-07-13 1980-07-11 A modified polyamide imide resin and its use for preparing electrical insulation materials and shaped articles
EP80104023A EP0023610B1 (en) 1979-07-13 1980-07-11 A modified polyamide imide resin and its use for preparing electrical insulation materials and shaped articles
US06/452,432 US4451621A (en) 1979-07-13 1982-12-23 Heat resistant resin composition comprising modified polyamide-imide resin having carboxyl groups

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8962679A JPS5614554A (en) 1979-07-13 1979-07-13 Heat resistant resin composition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP13534288A Division JPS63308037A (ja) 1988-06-01 1988-06-01 耐熱性樹脂の製造方法

Publications (2)

Publication Number Publication Date
JPS5614554A JPS5614554A (en) 1981-02-12
JPS6363567B2 true JPS6363567B2 (en]) 1988-12-07

Family

ID=13975955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8962679A Granted JPS5614554A (en) 1979-07-13 1979-07-13 Heat resistant resin composition

Country Status (4)

Country Link
US (2) US4387192A (en])
EP (1) EP0023610B1 (en])
JP (1) JPS5614554A (en])
DE (1) DE3066584D1 (en])

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56161457A (en) * 1980-05-17 1981-12-11 Kanegafuchi Chem Ind Co Ltd Heat-resisting resin composition
DE3241618A1 (de) * 1982-11-08 1984-05-10 Mannesmann AG, 4000 Düsseldorf Elektrische isolation fuer eine steckkontaktvorrichtung zum uebertragen von sehr kleinen elektrischen spannungen
US4622368A (en) * 1985-05-13 1986-11-11 General Electric Company Plasticized polyetherimide blends
DE3743780A1 (de) * 1987-12-23 1989-07-06 Bayer Ag Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf polyimidoberflaechen
JP2868043B2 (ja) * 1992-09-22 1999-03-10 三菱瓦斯化学株式会社 耐熱性樹脂組成物
JP2736860B2 (ja) * 1993-12-30 1998-04-02 後藤ガット有限会社 弦楽器ネック部の変歪矯正器
TWI468502B (zh) * 2012-07-04 2015-01-11 Uniplus Electronics Co Ltd 高耐熱、低剛性、難燃性樹脂及其組合物
TWI519559B (zh) 2014-11-21 2016-02-01 財團法人工業技術研究院 樹脂配方、樹脂聚合物及包含該聚合物之複合材料

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4419274B1 (en]) * 1965-03-30 1969-08-21
DE1770202C3 (de) * 1968-04-13 1975-02-27 Bayer Ag, 5090 Leverkusen Verfahren zur Herstellung von hochmolekularen Polyamid-tmiden
JPS4825424B1 (en]) * 1969-08-05 1973-07-28
US3843602A (en) * 1970-04-24 1974-10-22 Gen Electric Soluble amide-imide polymers terminated with olefin groups
DE2031072B2 (de) 1970-06-24 1977-08-25 Reichhold Chemie GmbH, 6200 Wiesbaden Verfahren zur herstellung von polyamidimidloesungen
JPS5232398B2 (en]) * 1972-12-18 1977-08-20
GB2008784B (en) * 1977-11-17 1982-04-15 Asahi Chemical Ind Heat resistant photoresist composition and process for preparing the same

Also Published As

Publication number Publication date
EP0023610A1 (en) 1981-02-11
DE3066584D1 (en) 1984-03-22
US4451621A (en) 1984-05-29
US4387192A (en) 1983-06-07
JPS5614554A (en) 1981-02-12
EP0023610B1 (en) 1984-02-15

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